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214 lines
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214 lines
11 KiB
Text
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SOLDERPAD HARDWARE LICENSE version 0.51
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This license is based closely on the Apache License Version 2.0, but is not
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approved or endorsed by the Apache Foundation. A copy of the non-modified
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Apache License 2.0 can be found at http://www.apache.org/licenses/LICENSE-2.0.
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As this license is not currently OSI or FSF approved, the Licensor permits
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any Work licensed under this License, at the option of the Licensee, to be
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treated as licensed under the Apache License Version 2.0 (which is so approved).
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This License is licensed under the terms of this License and in particular
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clause 7 below (Disclaimer of Warranties) applies in relation to its use.
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TERMS AND CONDITIONS FOR USE, REPRODUCTION, AND DISTRIBUTION
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1. Definitions.
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"License" shall mean the terms and conditions for use, reproduction, and distribution
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as defined by Sections 1 through 9 of this document.
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"Licensor" shall mean the Rights owner or entity authorized by the Rights
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owner that is granting the License.
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"Legal Entity" shall mean the union of the acting entity and all other entities
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that control, are controlled by, or are under common control with that entity.
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For the purposes of this definition, "control" means (i) the power, direct
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or indirect, to cause the direction or management of such entity, whether
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by contract or otherwise, or (ii) ownership of fifty percent (50%) or more
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of the outstanding shares, or (iii) beneficial ownership of such entity.
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"You" (or "Your") shall mean an individual or Legal Entity exercising permissions
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granted by this License.
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"Rights" means copyright and any similar right including design right (whether
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"Source" form shall mean the preferred form for making modifications, including
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but not limited to source code, net lists, board layouts, CAD files, documentation
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source, and configuration files.
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"Object" form shall mean any form resulting from mechanical transformation
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"Work" shall mean the work of authorship, whether in Source form or other
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Object form, made available under the License, as indicated by a Rights notice
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that is included in or attached to the work (an example is provided in the
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Appendix below).
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"Derivative Works" shall mean any work, whether in Source or Object form,
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annotations, elaborations, or other modifications represent, as a whole, an
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"Contribution" shall mean any design or work of authorship, including the
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or Derivative Works thereof, that is intentionally submitted to Licensor for
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"Contributor" shall mean Licensor and any individual or Legal Entity on behalf
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of whom a Contribution has been received by Licensor and subsequently incorporated
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within the Work.
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2. Grant of License. Subject to the terms and conditions of this License,
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each Contributor hereby grants to You a perpetual, worldwide, non-exclusive,
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no-charge, royalty-free, irrevocable license under the Rights to reproduce,
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prepare Derivative Works of, publicly display, publicly perform, sublicense,
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3. Grant of Patent License. Subject to the terms and conditions of this License,
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each Contributor hereby grants to You a perpetual, worldwide, non-exclusive,
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transfer the Work, where such license applies only to those patent claims
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4. Redistribution. You may reproduce and distribute copies of the Work or
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1. You must give any other recipients of the Work or Derivative Works a copy
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2. You must cause any modified files to carry prominent notices stating that
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You changed the files; and
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3. You must retain, in the Source form of any Derivative Works that You distribute,
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Works, if and wherever such third-party notices normally appear. The contents
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of the NOTICE file are for informational purposes only and do not modify the
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modifications and may provide additional or different license terms and conditions
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for use, reproduction, or distribution of Your modifications, or for any such
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Derivative Works as a whole, provided Your use, reproduction, and distribution
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of the Work otherwise complies with the conditions stated in this License.
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5. Submission of Contributions. Unless You explicitly state otherwise, any
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Contribution intentionally submitted for inclusion in the Work by You to the
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for reasonable and customary use in describing the origin of the Work and
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in writing, Licensor provides the Work (and each Contributor provides its
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of using or redistributing the Work and assume any risks associated with Your
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exercise of permissions under this License.
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8. Limitation of Liability. In no event and under no legal theory, whether
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in tort (including negligence), contract, or otherwise, unless required by
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applicable law (such as deliberate and grossly negligent acts) or agreed to
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in writing, shall any Contributor be liable to You for damages, including
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any direct, indirect, special, incidental, or consequential damages of any
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to use the Work (including but not limited to damages for loss of goodwill,
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work stoppage, computer failure or malfunction, or any and all other commercial
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damages or losses), even if such Contributor has been advised of the possibility
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of such damages.
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9. Accepting Warranty or Additional Liability. While redistributing the Work
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or Derivative Works thereof, You may choose to offer, and charge a fee for,
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acceptance of support, warranty, indemnity, or other liability obligations
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and/or rights consistent with this License. However, in accepting such obligations,
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You may act only on Your own behalf and on Your sole responsibility, not on
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behalf of any other Contributor, and only if You agree to indemnify, defend,
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and hold each Contributor harmless for any liability incurred by, or claims
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asserted against, such Contributor by reason of your accepting any such warranty
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or additional liability. END OF TERMS AND CONDITIONS
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APPENDIX: How to apply this license to your work
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To apply this license to your work, attach the following boilerplate notice,
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with the fields enclosed by brackets "[]" replaced with your own identifying
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archives.
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Copyright [yyyy] [name of copyright owner] Copyright and related rights are
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licensed under the Solderpad Hardware License, Version 0.51 (the "License");
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you may not use this file except in compliance with the License. You may obtain
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a copy of the License at http://solderpad.org/licenses/SHL-0.51. Unless required
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by applicable law or agreed to in writing, software, hardware and materials
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distributed under this License is distributed on an "AS IS" BASIS, WITHOUT
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WARRANTIES OR CONDITIONS OF ANY KIND, either express or implied. See the License
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for the specific language governing permissions and limitations under the
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License.
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